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- Current location: HomeProducts & SolutionsFPC MaterialConsumer ElectronicsPH Modified Solvent Based Bonding Sheet
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PH Modified Solvent Based Bonding Sheet
- Adhesive Type:
- Dongyi Model: PH
- Application Scenario: FPC Stiffener/PI/FR4/Steel sheet
- Introduction: It is mainly used in the manufacturing of electronic components and circuit boards, such as: inner-layer lamination of multi-layer boards, lamination of rigid-flex boards, chip packaging, etc.
Product Features:
It is used for the assembly and reinforcement of precision electronic components, and is particularly suitable for the processing of flexible printed circuits (FPC) and related components. It is applied to bonding and reinforcement products, and is optimal for bonding metal media (such as nickel-plated steel sheets, gold-plated steel sheets, and ordinary steel sheets).
Product Structure:
Application Scenario:
electron
Camera
light bar
Product Parameters:
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South China Headquarters
GUANGDONG DONGYI HIGH -TECH MATERIAL SCIENCE&TECHNOLOGY CO., LTD.
[Factory 1] No. 22 Changsheng Road, South District, Zhongshan City, Guangdong Province
[Factory 2] No.1 Zhichuang Road, Banfu Town, Zhongshan City, Guangdong Province
Phone: 0760-88892634 0760-88895714
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East China Branch
JIANGSU JUTEK ADVANCED MATERIAL SCIENCE & TECHNOLOGY CO., LTD.(Be wholly-owned subsidiary by Guangdong Dongyi)
Address: Building 3, No. 255 Renmin Middle Road, Chongchuan District, Nantong City, Jiangsu Province
Phone: 0513-80979666
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